The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Oct. 07, 2009
Applicants:

Hsin-chih Chiang, Hsinchu, TW;

Han-chung Tai, Kaohsiung, TW;

Inventors:

Hsin-Chih Chiang, Hsinchu, TW;

Han-Chung Tai, Kaohsiung, TW;

Assignee:

SYSTEM GENERAL CORPORATION, Sindian, Taipei County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823892 (2013.01); H01L 21/82385 (2013.01); H01L 21/823857 (2013.01); H01L 27/0928 (2013.01);
Abstract

A semiconductor device is provided and includes a substrate of a first conductivity type, a deep well of a second conductivity type, and a first high-side device. The deep well is formed on the substrate. The first high-side device is disposed within the deep well and includes an insulation layer of the second conductivity type, a well of the first conductivity type, first and second regions of the second conductivity type, and a first poly-silicon material. The insulation layer is formed on the substrate. The well is formed within the deep well. The first and second regions are formed within the well. The first poly-silicon material is disposed between the first region and the second region and on the deep well.


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