The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Mar. 20, 2014
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 13/04 (2006.01); B32B 19/00 (2006.01); A61F 13/15 (2006.01); C04B 35/653 (2006.01); C04B 35/52 (2006.01); C04B 35/56 (2006.01); H01L 21/67 (2006.01); C04B 35/575 (2006.01); C04B 35/626 (2006.01); C04B 37/00 (2006.01); B21D 53/02 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); B21D 53/02 (2013.01); B32B 9/005 (2013.01); B32B 37/10 (2013.01); B32B 38/0012 (2013.01); C04B 35/5615 (2013.01); C04B 35/575 (2013.01); C04B 35/62635 (2013.01); C04B 37/006 (2013.01); H01L 21/6833 (2013.01); B32B 2311/00 (2013.01); B32B 2311/24 (2013.01); B32B 2315/02 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/656 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/402 (2013.01); C04B 2237/708 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01);
Abstract
A dense composite material according to the present invention contains, in descending order of content, silicon carbide, titanium silicon carbide, and titanium carbide as three major constituents. The dense composite material contains 51% to 68% by mass of silicon carbide and no titanium silicide and has an open porosity of 1% or less. This dense composite material has properties such as an average linear thermal expansion coefficient of 5.4 to 6.0 ppm/K at 40° C. to 570° C., a thermal conductivity of 100 W/m·K or more, and a four-point bending strength of 300 MPa or more.