The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Dec. 12, 2014
Applicant:

Triton Microtechnologies, Oro Valley, AZ (US);

Inventors:

Tim Mobley, Marana, AZ (US);

Roupen Leon Keusseyan, Carlsbad, CA (US);

Charles Tucker, Los Olivos, CA (US);

Assignee:

TRITON MICROTECHNOLOGIES, Oro Valley, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 28/02 (2006.01); C23C 2/04 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); C23C 2/04 (2013.01); C23C 18/165 (2013.01); C23C 18/32 (2013.01); C23C 28/023 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/15 (2013.01); H01L 23/5384 (2013.01);
Abstract

A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.


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