The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Dec. 21, 2012
Applicant:

Samsung Electro-mechanics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Hye Yeon Cha, Gyeonggi-do, KR;

Kang Heon Hur, Gyeonggi-do, KR;

Sung Jin Park, Busan, KR;

Dong Jin Jeong, Busan, KR;

Jung Min Park, Gyeonggi-do, KR;

Hyeog Soo Shin, Busan, KR;

Sung Yong An, Gyeonggi-do, KR;

Hwan Soo Lee, Seoul, KR;

Young Do Kweon, Seoul, KR;

Jin Woo Hahn, Gyeonggi-do, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 5/00 (2013.01); H01F 17/0033 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 27/292 (2013.01); Y10T 29/4902 (2015.01);
Abstract

The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.


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