The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Apr. 20, 2012
Applicants:
Markus Menath, Regensburg, DE;
Thomas Fischer, Regensburg, DE;
Hermann Wendt, Regensburg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01F 38/14 (2006.01); H01L 21/02 (2006.01); H01F 17/02 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 21/027 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01F 17/02 (2013.01); H01F 17/0006 (2013.01); H01F 41/042 (2013.01); H01L 21/76816 (2013.01); H01L 23/5227 (2013.01); H01L 23/64 (2013.01); H01L 28/10 (2013.01); H01L 21/0274 (2013.01); H01L 21/76804 (2013.01); H01L 21/76877 (2013.01); H01L 23/5283 (2013.01); H01L 27/08 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48137 (2013.01); Y10T 29/4902 (2015.01);
Abstract
A method for manufacturing an electronic device and an electronic device are disclosed. In an embodiment the method comprises forming an opening in an isolation layer, isotropically etching the opening thereby forming an extended opening with curved sidewalls, and forming a conductive material in the opening.