The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Apr. 29, 2013
Applicants:

Arvind Kamath, Los Altos, CA (US);

Michael Kocsis, San Francisco, CA (US);

Kevin Mccarthy, Milpitas, CA (US);

Gloria Wong, Mountain View, CA (US);

Jiang LI, Cupertino, CA (US);

Inventors:

Arvind Kamath, Los Altos, CA (US);

Michael Kocsis, San Francisco, CA (US);

Kevin McCarthy, Milpitas, CA (US);

Gloria Wong, Mountain View, CA (US);

Jiang Li, Cupertino, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01Q 7/00 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01Q 1/22 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 5/003 (2013.01); H01F 5/00 (2013.01); H01L 27/1218 (2013.01); H01L 27/1292 (2013.01); H01L 29/78603 (2013.01); H01Q 1/2283 (2013.01); H01Q 7/00 (2013.01); H01F 41/041 (2013.01); H01L 29/7869 (2013.01); H01L 29/78681 (2013.01);
Abstract

Devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The devices include a metal substrate, a diffusion barrier layer on the metal substrate, one or more insulator layers on the diffusion barrier layer, and an antenna and/or inductor on the one or more insulator layer(s). The method includes forming a diffusion barrier layer on the metal substrate, forming one or more insulator layers on the diffusion barrier layer; and forming an antenna and/or inductor on an uppermost one of the insulator layer(s). The antenna and/or inductor is electrically connected to at least one of the diffusion barrier layer and/or the metal substrate. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into device layers formed thereon.


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