The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Nov. 28, 2011
Applicants:

Teruyuki Kitagawa, Himeji, JP;

Shuhei Nomura, Himeji, JP;

Inventors:

Teruyuki Kitagawa, Himeji, JP;

Shuhei Nomura, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); H01B 1/04 (2006.01); C23C 14/02 (2006.01); C23C 14/22 (2006.01); C01B 31/02 (2006.01); C23C 14/34 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
H01B 1/04 (2013.01); C01B 31/02 (2013.01); C23C 14/022 (2013.01); C23C 14/024 (2013.01); C23C 14/0605 (2013.01); C23C 14/22 (2013.01); C23C 14/221 (2013.01); C23C 14/3442 (2013.01); G01R 1/067 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A film is formed under vacuum by a step of purifying and/or flattening the base material () by irradiating the base material () with a gas cluster ion beam (); by a step of forming an intermediate layer film by evaporating/vaporizing an intermediate layer film forming material, allowing the evaporated/vaporized material to adhere to the surface of the base material (), and irradiating the intermediate layer film forming material with a gas cluster ion beam (); and by evaporating/vaporizing a carbon film forming material containing a carbonaceous material containing substantially no hydrogen, and a boron material, allowing the evaporated/vaporized material to adhere to the surface of the intermediate layer film, and irradiating the carbon film forming material with a gas cluster ion beam ().


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