The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Aug. 22, 2014
A2 Surgical, Saint-Pierre-d'Allevard, FR;
Laurence Chabanas, Saint-Pierre-d'Allevard, FR;
Stéphane Lavallee, St Martin d'Uriage, FR;
Jérôme Tonetti, Grenoble, FR;
Thomas Byrd, Nashville, TN (US);
Bryan Talmadge Kelly, Riverside, CT (US);
Christopher Larson, Edina, MN (US);
A2 Surgical, , FR;
Abstract
The invention relates to a method for automatically determining, on a bone comprising a head portion contiguous to a neck portion, parameters for characterizing a bump deformation on the head-neck junction of the bone from acquired 3D medical image, the method comprising the following steps: i) constructing a 3D surface model of the bone; ii) fitting a sphere on the spherical portion of the head of the bone; iii) determining a neck axis characterizing the neck portion of the bone; iv) determining from the fitted sphere and the neck axis, a clock face referential on the head of the bone rotating around the neck axis; v) determining a 3D curve on the 3D surface model characterizing the head-neck junction of the bone; vi) determining, from the 3D curve, the summit of the bump deformation of the head-neck junction of the bone; vii) determining, from said summit of the bump deformation, first and a second parameters (α3D, iMax) characterizing the maximum bump deformation of the head-neck junction of the bone.