The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Feb. 25, 2011
Applicants:

Jari Kaipio, North Shore, NZ;

Marko Vauhkonen, Kuopio, FI;

Juha Reunanen, Helsinki, FI;

Anssi Lehikoinen, Kuopio, FI;

Inventors:

Jari Kaipio, North Shore, NZ;

Marko Vauhkonen, Kuopio, FI;

Juha Reunanen, Helsinki, FI;

Anssi Lehikoinen, Kuopio, FI;

Assignee:

Outotec Oy, Espoo, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 13/20 (2006.01); G01F 23/24 (2006.01); G01F 23/00 (2006.01); G01F 23/26 (2006.01);
U.S. Cl.
CPC ...
G01F 23/242 (2013.01); G01F 23/0061 (2013.01); G01F 23/268 (2013.01);
Abstract

The present invention describes a method, apparatus and computer program for detecting the locations of boundaries between different materials in a desired measurement volume. The apparatus uses at least one measuring probe, the electrodes of which are characterized in that they together form an assembly that differs from a straight line. In addition, a volume at a further distance from the assembly can also be observed by the assembly, so that measurements can be conducted remotely and, on the other hand, the apparatus stays unbroken in diverse measurement situations. By using the EIT-measurement and applying for example a so-called 1D-σ-method or methods of machine learning, electrical conductivity distributions in the measured volume are detected. As a result, the locations of the possible boundaries between different materials or for example thicknesses of different material layers are detected.


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