The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jun. 14, 2011
Applicants:

Akihide Shibata, Osaka, JP;

Tetsu Negishi, Osaka, JP;

Kenji Komiya, Osaka, JP;

Yoshifumi Yaoi, Osaka, JP;

Takeshi Shiomi, Osaka, JP;

Hiroshi Iwata, Osaka, JP;

Akira Takahashi, Osaka, JP;

Inventors:

Akihide Shibata, Osaka, JP;

Tetsu Negishi, Osaka, JP;

Kenji Komiya, Osaka, JP;

Yoshifumi Yaoi, Osaka, JP;

Takeshi Shiomi, Osaka, JP;

Hiroshi Iwata, Osaka, JP;

Akira Takahashi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01); C25D 13/00 (2006.01); H01L 21/479 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/24 (2010.01); H01L 27/15 (2006.01); H01L 33/18 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
C25D 13/00 (2013.01); H01L 21/479 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 24/80 (2013.01); H01L 27/156 (2013.01); H01L 33/18 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75655 (2013.01); H01L 2224/75723 (2013.01); H01L 2224/80143 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95145 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15788 (2013.01);
Abstract

This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects () are to be disposed in an area where a first electrode () and a second electrode () face each other, and in a fluid introducing step, a fluid () is introduced on the substrate (). The fluid () contains a plurality of the fine objects (). The fine objects () are diode elements, each of which has, as an alignment structure, a front side layer () composed of a dielectric material, and a rear side layer () composed of a semiconductor. In the fine object disposing step, by applying an AC voltage to between the first electrode () and the second electrode (), the fine objects () are disposed by dielectrophoresis with the front side layer () facing up at the predetermined positions in the area (A) where the first electrode () and the second electrode () face each other.


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