Silicone resin composition, cured silicone resin, and sealed optical semiconductor element

Abstract

The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition. The present invention relates to a silicon resin composition comprising: a silicon resin mixture; and (B) a silicon compound, the silicon resin mixture containing (A-i) polyorganosiloxane that has at least two substituents each having a carbon-carbon double bond bonded to a silicon atom, (A-ii) polyorganohydrogen siloxane having at least two hydrogen groups each bonded to a silicon atom, and (A-iii) a hydrosilylation catalyst, the (B) silicone compound having a structural unit represented by Formula (1-3) and a structural unit represented by Formula (1-4) between a structural unit represented by Formula (1-1) and a structural unit represented by Formula (1-2): in Formula (1-1) and Formula (1-2), Rs each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3) and Formula (1-4), Rs each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3), Rrepresenting a C1-C8 alkylene group in which a part of carbon atoms, except for the carbon atom bonded to a silicon atom, is optionally substituted with an oxygen atom, Rrepresenting a C1-C3 alkylene group, Rrepresenting a C1-C3 alkylene group, Rrepresenting a hydrogen atom, a C1-C3 alkyl group, a C1-C3 alkyl group having an OH group, or a halogeno group, in Formula (1-3), m representing an integer of 1 to 50, x representing an integer of 0 to 2, and in Formula (1-4), n representing an integer of 10 to 1500.