The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Jul. 03, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 13/00 (2006.01); B41J 29/13 (2006.01); B41J 2/175 (2006.01); B41J 29/02 (2006.01);
U.S. Cl.
CPC ...
B41J 13/0009 (2013.01); B41J 29/02 (2013.01); B41J 29/13 (2013.01); B41J 2/14072 (2013.01); B41J 2/1752 (2013.01); B41J 13/00 (2013.01); B41J 29/023 (2013.01); B41J 29/026 (2013.01); B41J 2002/14491 (2013.01);
Abstract
A main substrate which is arranged in one end section of a main apparatus body in the width direction is horizontally arranged using a free space in one end section of the mechanical component arrangement area in a main apparatus body in the width direction. A plurality of relay substrates are vertically provided in the upper-side position of the main substrate in the mechanical component arrangement area, and the main substrate is connected to the plurality of relay substrates through FFCs connected to respective connectors. A plurality of connectors are provided on the two relay substrates in order to connect to wirings from a printer mechanism section.