The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Nov. 22, 2011
Hans Lind, Linkoping, SE;
Rikard Forsen, Linkoping, SE;
Mats Johansson, Linkoping, SE;
Ferenc Tasnadi, Linkoping, SE;
Naureen Ghafoor, Linkoping, SE;
Bjorn Alling, Linkoping, SE;
Magnus Oden, Tullinge, SE;
Igor Abrikossov, Linkoping, SE;
Hans Lind, Linkoping, SE;
Rikard Forsen, Linkoping, SE;
Mats Johansson, Linkoping, SE;
Ferenc Tasnadi, Linkoping, SE;
Naureen Ghafoor, Linkoping, SE;
Bjorn Alling, Linkoping, SE;
Magnus Oden, Tullinge, SE;
Igor Abrikossov, Linkoping, SE;
SECO TOOLS AB, Fagersta, SE;
Abstract
A cutting tool insert for machining by chip removal includes a body of a hard alloy of cemented carbide, cermet, ceramics, polycrystalline diamond or cubic boron nitride based materials onto which a hard and wear resistant coating is deposited by physical vapour deposition (PVD). The coating includes at least one layer of a NaCl-structured (TiAlCrMe)(CON) where Me is one or more of the elements Zr, Hf, V, Nb, Ta, Mo, W and/or Si, 0.10<a<0.60, b+d>0.20, c>0.05, 0≦d<0.25, 0.75<x<1.05, 0≦y<0.25 and 0≦z≦0.25 with a thickness between 0.5 and 10 μm. The layer has a columnar mictrostructure with an average columnar width of <1 μm, a compressive stress level of −6 GPa<σ<−0.5 GPa and a nanohardness >25 GPa.