The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jan. 27, 2012
Applicants:

Kentaro Tsuzuki, Nasushiobara, JP;

Takashi Kubota, Otawara, JP;

Yutaka Oonuki, Otawara, JP;

Yasuhisa Makita, Nasushiobara, JP;

Inventors:

Kentaro Tsuzuki, Nasushiobara, JP;

Takashi Kubota, Otawara, JP;

Yutaka Oonuki, Otawara, JP;

Yasuhisa Makita, Nasushiobara, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/00 (2013.01); B06B 1/06 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0629 (2013.01); B06B 1/067 (2013.01); B32B 38/0004 (2013.01); Y10T 156/1082 (2015.01);
Abstract

The purpose is to provide an ultrasound transducer and ultrasound probe without the complexity of the manufacturing process of the non-conductive acoustic matching layer while ensuring the electric conductive path. Pluralities of two-dimensionally arranged piezoelectrics are comprised in the ultrasound transducer. Electrodes are provided for each piezoelectric. Furthermore, the non-conductive acoustic matching layer with the first surface on the electrode side and the second surface on the opposite side of the first surface is comprised in the ultrasound transducer, and moreover, the electric conductive acoustic matching layer arranged on the second surface side of the non-conductive acoustic matching layer is comprised in the ultrasound transducer. Moreover, the substrate arranged on the opposite side of the non-conductive acoustic matching layer is arranged with respect to the electric conductive acoustic matching layer. The plurality of grooves penetrating the non-conductive acoustic matching layer, leading up to mid-way of the piezoelectrics of the first surface side or mid-way of the electric conductive acoustic matching layer of the second surface side is formed between the first surface and the second surface of the non-conductive acoustic matching layer. Moreover, the electrode and the substrate are electrically conducted via the groove.


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