The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jul. 05, 2011
Applicant:
Jean Brun, Champagnier, FR;
Inventor:
Jean Brun, Champagnier, FR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 13/04 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 13/046 (2013.01); H01L 23/4985 (2013.01); H01L 23/562 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 1/189 (2013.01); H01L 23/13 (2013.01); H01L 23/5389 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80007 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80903 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/90 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12041 (2013.01); H05K 1/0281 (2013.01); H05K 1/038 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0108 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.