The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jul. 15, 2010
Shin Soyano, Shiojiri, JP;
Masaki Ono, Nagano, JP;
Kenji Suzuki, Azumino, JP;
Akira Morozumi, Okaya, JP;
Shin Soyano, Shiojiri, JP;
Masaki Ono, Nagano, JP;
Kenji Suzuki, Azumino, JP;
Akira Morozumi, Okaya, JP;
FUJI ELECTRIC CO., LTD., , JP;
Abstract
The characteristics of a heat radiation member used in a semiconductor module are improved. A heat radiation member (A) including an aluminum type member () which contains aluminum and a copper type member () which contains copper, which is embedded in the aluminum type member (), and sides of which are enclosed by the aluminum type member () is formed. A semiconductor element is thermally bonded to the heat radiation member (A) to fabricate a semiconductor module. The heat radiation member (A) includes the aluminum type member () and the copper type member (). As a result, it is possible to realize light weight while ensuring certain heat radiation. In addition, the copper type member () is enclosed by the aluminum type member (). Accordingly, the strength of the heat radiation member (A) can be increased.