The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Aug. 03, 2012
Joseph Kuczynski, Rochester, MN (US);
Melissa K. Miller, Research Triangle Park, NC (US);
Heidi D. Williams, Cary, NC (US);
Jing Zhang, Poughkeepsie, NY (US);
Joseph Kuczynski, Rochester, MN (US);
Melissa K. Miller, Research Triangle Park, NC (US);
Heidi D. Williams, Cary, NC (US);
Jing Zhang, Poughkeepsie, NY (US);
Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A conductive via and method of forming a conductive via in a multilayer printed circuit board are disclosed. A hole is drilled into a printed circuit board that is reinforced with glass fibers, wherein the hole extends between two conductive elements on different layers of the printed circuit board and cuts through a portion of the glass fibers. A tungsten nitride layer is then deposited on the walls of the hole, wherein the tungsten nitride layer has a thickness between 1.5 nanometers and 20 nanometers. A copper layer is deposited over the tungsten nitride layer, wherein the copper and tungsten nitride form a conductive via that provides an electrically conductive pathway between the two conductive elements, and wherein the tungsten nitride layer isolates the copper layer from the glass fibers.