The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jul. 16, 2014
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Kenichi Takahashi, Kanagawa, JP;
Kazuhiko Ikeda, Kanagawa, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Abstract
The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper platingon an insulation layeror forming a copper thin film on the insulation layerusing a sputtering method; subjecting the obtained copper surfaceto a roughening treatment using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles; attaching a dry film resistto the copper surfaceafter the roughening treatment to perform exposure and development and providing an electrolytic copper platingto an openingafter the exposure; and subjecting the remaining dry film resist to a stripping treatment using a resist stripping liquid containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycols and 0.01 to 0.5% by mass of azoles.