The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Dec. 24, 2014
Applicant:

Shenzhen Goldsun Network Intelligence Technology Co., Ltd., ShenZhen, CN;

Inventors:

Ten-Hsing Jaw, Zhubei, TW;

Chin-Yang Wu, Zhubei, TW;

Szu-Wei Sung, New Taipei, TW;

Chiu-Chi Chen, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); H05K 3/00 (2006.01); G06F 3/042 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/00 (2013.01); G06F 3/041 (2013.01); G06F 3/042 (2013.01); H01L 27/1255 (2013.01); H05K 2203/308 (2013.01);
Abstract

A method for manufacturing a touch panel includes the following procedures. A first conductive layer and a shielding layer surrounding the first conductive layer are formed on a base plate. The first conductive layer is etched to form a plurality of first and second sensing pads alternatively arranged according to columns. The first sensing pads in a column along a first direction are electrically coupled to each other to form a first sensing electrode column. The second sensing pads in a column along a second direction are electrically coupled to each other to form a second sensing electrode column. A second conductive layer is formed on the shielding layer via an ink jet printing method, and is etched to form a plurality of first and second sensing lines to be respectively electrically coupled to the first and second sensing electrode columns.


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