The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Nov. 11, 2013
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventor:

Tomoyuki Akahoshi, Atsugi, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0248 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H05K 1/113 (2013.01); H01L 2224/16238 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09263 (2013.01);
Abstract

A wiring board includes a first wiring line and a second wiring line formed on a substrate, a first land and a second land respectively formed at a connection portion of the first wiring line and the second wiring line. A second wiring line has a longer wiring length than the first wiring line. The land is structured with a wiring pattern of a single wiring line. The wiring board also includes a first pad electrode and a second pad electrode respectively formed on the first land and a second land through an insulating film, a first interlayer connection via and a interlayer connection via embedded in the insulating film and electrically connecting the land to the pad electrode. And a wiring length of the wiring pattern of the first land is longer than the wiring length of the wiring pattern of the second land.


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