The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Feb. 13, 2013
Applicant:

Lear Corporation, Southfield, MI (US);

Inventors:

Steven F. Gawron, Plymouth, MI (US);

Jonathan Dahlstrom, Highland, MI (US);

Assignee:

Lear Corporation, Southfield, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H05K 1/184 (2013.01); H05K 3/00 (2013.01); H05K 3/06 (2013.01); H05K 2201/10303 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A solder validation method for a printed circuit board (PCB) having a pin hole extending through the PCB, an electrically conductive trace on a surface of the PCB, and an electrically conductive pin inserted through the pin hole includes the following. An electrically non-conductive portion is provided on the surface of the PCB between the pin hole and the trace such that the non-conductive portion electrically isolates the pin from the trace. After a soldering process intended to solder the pin and the trace together, a soldered connection between the pin and the trace is detected as being absent when no electrical continuity is between the pin and the trace as a soldered connection between the pin and the trace has to be present to provide the electrical continuity due to the pin and the trace otherwise being electrically isolated from one another by the non-conductive portion.


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