System for grounding in an electronic device

Abstract

A system for grounding in a electronic device is disclosed. The system comprises a first electronic board, this latter comprising a first ground plane and at least one footprint intended to connect the first ground plane to a component, the at least one footprint defining a closed line on said first electronic board adapted to connect the component, at least a second electronic board comprising a second ground plane, the second electronic board being superposed on the first electronic board, a grounding metallic piece comprising a wall perpendicular to said first electronic board and a base parallel to said first electronic board. The system being notable in that the metallic piece is dimensioned such that the wall corresponds to a perpendicular projection of said closed line defined by one of the at least one footprints and such that the shape of base corresponds to the shape defined by the closed line, and in that the base comprises elements providing a contact with the second electronic board thus electrically connecting the second ground plane with the first ground plane. The elements providing a contact with the second electronic board are for example contact strips or balls.