The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Sep. 13, 2011
Applicants:
Uwe Strauss, Bad Abbach, DE;
Markus Arzberger, Regensburg, DE;
Inventors:
Uwe Strauss, Bad Abbach, DE;
Markus Arzberger, Regensburg, DE;
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01S 5/024 (2006.01); H01L 33/62 (2010.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/024 (2013.01); H01L 23/495 (2013.01); H01S 5/02244 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01S 5/02216 (2013.01); H01S 5/02276 (2013.01); H01S 5/02288 (2013.01); H01S 5/02296 (2013.01); H01S 5/02476 (2013.01);
Abstract
A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. The leadframe has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane. A semiconductor component having such a housing and a semiconductor chip and a method for producing a housing are also disclosed.