The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Oct. 15, 2014
Applicant:

Delta Electronics, Inc., Taoyuan County, TW;

Inventors:

Yu-Liang Lin, Taoyuan County, TW;

Wen-Ping Teng, Taoyuan County, TW;

Jie Li, Taoyuan County, TW;

Guang Yang, Taoyuan County, TW;

Wen-Yi Chien, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/62 (2011.01); H01R 12/51 (2011.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H01R 12/62 (2013.01); H01R 12/51 (2013.01); H05K 1/0298 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/05 (2013.01);
Abstract

The present invention provides a flexible printed circuit board having gold fingers, comprising a base sheet, a metallic layer and a protective sheet. The base sheet has a plurality of voids thereon. The metallic layer is provided on the base sheet, and has at least one plated through hole. The protective sheet is provided on the base sheet and the metallic layer to expose a portion of the metallic layer and the plated through hole. The flexible printed circuit board may electrically be connected to a conductive terminal of a rigid printed circuit board with one gold finger and electrically be connected to a system with another gold finger. The plated through hole has a function of heat conduction and soldering, and the voids of the flexible printed circuit board can provide a space for overflowing solder and heat dissipation.


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