The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

May. 06, 2008
Applicants:

Boris Iwanschitz, Winterthur, CH;

Josef Sfeir, Buelach, CH;

Ueli Weissen, Winterthur, CH;

Andreas Kaiser, Roskilde, DK;

Inventors:

Boris Iwanschitz, Winterthur, CH;

Josef Sfeir, Buelach, CH;

Ueli Weissen, Winterthur, CH;

Andreas Kaiser, Roskilde, DK;

Assignee:

Hexis AG, Winterthur, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/24 (2006.01); H01M 8/02 (2006.01); H01M 8/24 (2006.01); H01M 4/86 (2006.01); H01M 8/12 (2006.01);
U.S. Cl.
CPC ...
H01M 8/0297 (2013.01); H01M 8/025 (2013.01); H01M 8/0234 (2013.01); H01M 8/0239 (2013.01); H01M 8/0243 (2013.01); H01M 8/0245 (2013.01); H01M 8/2425 (2013.01); H01M 4/8657 (2013.01); H01M 2008/1293 (2013.01); Y02E 60/50 (2013.01); Y02E 60/525 (2013.01);
Abstract

The method serves for the manufacture of contacts between electrochemically active discs () and interconnectors () in planar high temperature fuel cells. The interconnectors have air-side and gas-side surface profiles (') with contact surfaces () located on raised portions (). A layer consisting of a contacting mixture (′) is respectively applied onto the electrodes (′) of the electrochemically active discs or onto the contact surfaces. The surface profiles for the electrodes are brought into contact with the applied layer so that, at a working temperature, the raised portions penetrate into this layer. Connections are formed between the contact surfaces and electrically conductive particles in this way and thus form discrete, homogeneously structured connections between the contact surfaces and the electrodes. Finally the medium embedding the particles is removed under thermal part treatments and the discrete connections are solidified.


Find Patent Forward Citations

Loading…