The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Mar. 04, 2014
Applicant:

National Tsing Hua University, Hsinchu, TW;

Inventors:

Chrong Jung Lin, Hsinchu, TW;

Ya-Chin King, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01); H01L 43/02 (2006.01); G01R 33/02 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); G01R 33/02 (2013.01); G01R 33/098 (2013.01); H01L 25/16 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A three-dimensional integrated circuit includes a plurality of perpendicular stacked chips. Each chip of the plurality of perpendicular stacked chips includes at least one transistor, a sensing coil, and a magnetic sensor, wherein the magnetic sensor is installed above the at least one transistor and the sensing coil and the sensing coil is installed between the magnetic sensor and the at least one transistor. The chip utilizes the sensing coil to generate a magnetic field including data, and a first chip of the plurality of perpendicular stacked chips adjacent to the chip utilizes a magnetic sensor of the first chip to receive the data generated by the sensing coil of the chip through the magnetic field generated by the sensing coil of the chip.


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