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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9177945 B1

PDFFull Text
Date of Patent:
Nov. 03, 2015

Filed:

Dec. 17, 2014

Packaged semiconductor device having multilevel leadframes configured as modules

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Richard J. Saye, Greenville, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Steven A. Shaw

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/495 (2013.01); H01L 23/49537 (2013.01); H01L 23/49551 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 2924/15747 (2013.01);
Abstract

Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes.

Find Patent Forward Citations

Saye, Richard. (2015). Packaged semiconductor device having multilevel leadframes configured as modules (U.S. Patent No. 9177945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9177945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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