The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9177935 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 03, 2015

Filed:

Jan. 24, 2014
Applicants:

Youn JO Ko, Uiwang-si, KR;

Hye Su Ki, Uiwang-si, KR;

IE Ju Kim, Uiwang-si, KR;

Inventors:

Youn Jo Ko, Uiwang-si, KR;

Hye Su Ki, Uiwang-si, KR;

Ie Ju Kim, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); C09J 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); C09J 9/02 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/293 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/07802 (2013.01);
Abstract

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a binder resin; a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof; and conductive particles, the anisotropic conductive film having a moisture permeability of 170 g/m/24 hr or less and a moisture absorbency of 2% or less.


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Ko, Youn. (2015). Semiconductor device connected by anisotropic conductive film having a reliability adhesive strength (U.S. Patent No. 9177935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9177935

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