The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Apr. 03, 2012
Applicants:
Nathan P. Lower, North Liberty, IA (US);
Ross K. Wilcoxon, Cedar Rapids, IA (US);
Nathaniel P. Wyckoff, Marion, IA (US);
Inventors:
Nathan P. Lower, North Liberty, IA (US);
Ross K. Wilcoxon, Cedar Rapids, IA (US);
Nathaniel P. Wyckoff, Marion, IA (US);
Assignee:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/522 (2013.01); H01L 21/50 (2013.01);
Abstract
A method of manufacturing an integrated circuit device includes providing a substrate; forming at least one cavity in the substrate; positioning a die within the at least one cavity of the substrate; and depositing a die attach material around the die within the at least one cavity to mechanically bond the die to the substrate.