The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Mar. 02, 2015
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Seon Kwang Jeon, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A semiconductor package may include first and second semiconductor chips stacked one upon the other, and each including, over a bottom surface thereof, first normal pads electrically coupled with first input/output circuits and first dummy pads located over the bottom surface of the first semiconductor chip. The semiconductor package may include first through electrodes passed through the first semiconductor chip, and electrically coupled to the first dummy pads of the first semiconductor chip and the first normal pads of the second semiconductor chip. The semiconductor package may include a substrate configured to support the bottom surface of the first semiconductor chip, and including first coupling pads electrically coupled with the first normal pads and the first dummy pads of the first semiconductor chip, respectively.