The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jan. 22, 2015
Intersil Americas Llc, Milpitas, CA (US);
Randolph Cruz, Melbourne, FL (US);
Loyde Milton Carpenter, Jr., Palm Bay, FL (US);
Intersil Americas LLC, Milpitas, CA (US);
Abstract
Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a non-conductive material and is adhered to the two or more adjacent sections of the lead frame. The plug functions to impede the flow of solder along edges of the two or more adjacent sections during second level solder reflow events that occur after encapsulation of the packaged component. The plug includes a main portion disposed within a space between the two or more adjacent sections, and one or more overlap portions extending from the main portion. The one or more overlap portions are disposed on an internal surface of at least one of the two or more adjacent sections. At least one component is mounted on one of the plurality of sections of the lead frame.