The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Nov. 26, 2007
Applicant:
Simon Jonathan Stacey, Suffolk, GB;
Inventor:
Simon Jonathan Stacey, Suffolk, GB;
Assignee:
Cambridge Silicon Radio Limited, Cambridge, GB;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H01L 23/31 (2006.01); H01L 23/28 (2006.01); H01L 23/532 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 23/28 (2013.01); H01L 23/29 (2013.01); H01L 23/532 (2013.01); H01L 24/10 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01);
Abstract
A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less.