The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Apr. 22, 2014
Applicant:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Inventors:
Soon-Won Jung, Daejeon, KR;
Jae Bon Koo, Daejeon, KR;
Chan Woo Park, Daejeon, KR;
Bock Soon Na, Daejeon, KR;
Sang Chul Lim, Daejeon, KR;
Sang Seok Lee, Sejong, KR;
Kyoung Ik Cho, Daejeon, KR;
Hye Yong Chu, Daejeon, KR;
Assignee:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/311 (2013.01); H01L 29/66477 (2013.01);
Abstract
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.