The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Sep. 23, 2011
Applicants:

Tomoro Abe, Nagaokakyo, JP;

Masato Nishioka, Nagaokakyo, JP;

Inventors:

Tomoro Abe, Nagaokakyo, JP;

Masato Nishioka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/08 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 4/08 (2013.01); H01G 4/30 (2013.01); Y10T 29/49117 (2015.01);
Abstract

In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called 'putty', and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.


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