The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Sep. 09, 2013
Sh Copper Products Co., Ltd., Tsuchiura, JP;
Yoshihide Wadayama, Hitachiota, JP;
Katsumi Ohata, Tsuchiura, JP;
Kazuhiko Nakagawa, Tsuchiura, JP;
Morio Kimura, Kasumigaura, JP;
SH COPPER PRODUCTS CO., LTD., Tsuchiura, Ibaraki, JP;
Abstract
A precursor for a NbSn superconductor wire to be manufactured by the internal diffusion method, includes a plurality of Nb-based single core wires, each of which includes a Nb-based core coated with a Cu-based coating including a Cu-based matrix, a plurality of Sn-based single core wires, each of which includes a Sn-based core coated with a Cu-based coating including a Cu-based matrix; and a cylindrical diffusion barrier including Ta or Nb, in which the plurality of Nb-based single core wires and the plurality of Sn-based single core wires are regularly disposed, wherein the plurality of Nb-based single core wires include Nb-based single core wires having a Cu/Nb ratio of 0.4 or more, wherein the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core.