The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Feb. 05, 2014
Applicant:

Oracle International Corporation, Redwood City, CA (US);

Inventors:

Wonjoon Choi, Austin, TX (US);

Akshay Sharma, Austin, TX (US);

Huy Tran Ba Vo, Austin, TX (US);

Guo Yu, Cedar Park, TX (US);

Assignee:

Oracle International Corporation, Redwood City, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5054 (2013.01);
Abstract

Implementations of the present disclosure involve methods and systems for component placement in a datapath block of a microelectronic circuit design. In particular, implementations provide for collecting groups of common components in the datapath block that form a row or partial row. A preliminary layout of the datapath block is performed with the component set rows and any other components of the datapath block design. Common components are then collected into groups or sets to form additional rows within the datapath layout, with at least some consideration to the wire lengths between components in the rows. By collecting common components into rows with consideration to the wire lengths between interconnected components, the timing performance of the datapath block may be improved.


Find Patent Forward Citations

Loading…