The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Oct. 15, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yada Zhu, White Plains, NY (US);

Jingrui He, Yorktown Heights, NY (US);

Robert Jeffrey Baseman, Brewster, NY (US);

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); G05B 13/02 (2006.01); G06F 17/00 (2006.01); G06F 11/00 (2006.01); H01L 21/00 (2006.01); G06F 7/60 (2006.01); G06F 17/50 (2006.01); G06F 11/16 (2006.01); G06F 11/22 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2831 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention generally relates to the monitoring and controlling of a semiconductor manufacturing environment and, more particularly, to methods and systems for virtual meteorology (VM) applications based on data from multiple tools having heterogeneous relatedness. The methods and systems leverage the natural relationship of the multiple tools and take advantage of the relationship embedded in process variables to improve the prediction performance of the VM predictive wafer quality modeling. The prediction results of the methods and systems can be used as a substitute for or in conjunction with actual metrology samples in order to monitor and control a semiconductor manufacturing environment, and thus reduce delays and costs associated with obtaining actual physical measurements.


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