The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Feb. 20, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Noboru Furuya, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1607 (2013.01); B41J 2/1625 (2013.01); B41J 2/1643 (2013.01); H01L 41/0477 (2013.01); B41J 2002/14491 (2013.01);
Abstract
A flow channel substrate has pressure chambers, and the pressure chambers communicate with nozzle openings configured to eject liquid. Each of piezoelectric elements on the flow channel substrate has a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes. The wiring layer has a first layer on the flow channel substrate side and a second layer on the first layer. The first layer contains palladium and is formed by pretreatment, whereas the second layer contains nickel and is formed by electroless plating.