The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Aug. 01, 2013
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Satoshi Ibe, Yokohama, JP;
Yoshinori Tagawa, Yokohama, JP;
Jun Yamamuro, Yokohama, JP;
Hiroto Komiyama, Tokyo, JP;
Kouji Hasegawa, Kawasaki, JP;
Shiro Sujaku, Kawasaki, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B41J 2/14072 (2013.01); B41J 2/1603 (2013.01); B41J 2/1621 (2013.01); B41J 2/1631 (2013.01); B41J 2/1643 (2013.01);
Abstract
A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.