The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 14, 2013
Applicants:

Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Zhao-Qian Zhang, Shenzhen, CN;

Wen-Cai Zhou, Shenzhen, CN;

Xue-Hua Lei, Shenzhen, CN;

Peng-Hui Chen, Shenzhen, CN;

Ying-Jun Peng, Shenzhen, CN;

Wen-Jie Lang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 38/18 (2006.01); B23Q 1/64 (2006.01);
U.S. Cl.
CPC ...
B32B 38/18 (2013.01); B23Q 1/64 (2013.01); B32B 38/1833 (2013.01); B32B 2315/08 (2013.01); Y10T 156/17 (2015.01);
Abstract

A positioning mechanism includes a loading assembly and a clamping assembly. The clamping assembly includes a driver mounted on the bottom of the loading assembly, at least two sliding members driven by the driver, and at least two clamping subassemblies mounted on the top of the loading assembly. The clamping subassemblies are divided into two groups and are arranged and mounted adjacent to opposite sides of the loading assembly, and the sliding members are connected to the two groups of the at least two clamping subassemblies, respectively. The driver is capable of driving the sliding members to move away from or toward each other to enable the two groups of the clamping subassemblies to move toward or away from the loading assembly to clamp or release a workpiece on the loading assembly. The present invention further discloses a bonding device using the positioning mechanism.


Find Patent Forward Citations

Loading…