The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Nov. 02, 2012
Applicants:

Brigham Young University, Provo, UT (US);

Moxtek, Inc., Orem, UT (US);

Inventors:

Robert C. Davis, Provo, UT (US);

Richard Vanfleet, Provo, UT (US);

Kyle Zufeldt, Orem, UT (US);

Andrew L. Davis, Provo, UT (US);

Steven D. Liddiard, Springville, UT (US);

Assignees:

Brigham Young University, Provo, UT (US);

Moxtek, Inc., Orem, UT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 35/18 (2006.01); H01J 5/18 (2006.01); H01J 33/04 (2006.01); B32B 7/02 (2006.01); G21K 1/00 (2006.01); H01J 9/24 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); G21K 1/00 (2013.01); H01J 5/18 (2013.01); H01J 9/24 (2013.01); H01J 35/18 (2013.01); B29K 2307/04 (2013.01); H01J 2235/18 (2013.01); H01J 2235/183 (2013.01); Y10T 428/24124 (2015.01);
Abstract

A high strength carbon fiber composite (CFC) wafer, and method of making such wafer, with low surface roughness comprising at least one sheet of CFC including carbon fibers embedded in a matrix. The wafer can have a thickness of between 10-500 micrometers. The wafer can have a root mean square surface roughness Rq, on at least one side, of less than 300 nm in an area of 100 micrometers by 100 micrometers and less than 500 nm along a line of 2 millimeter length. The wafer may be cut to form x-ray window support structures, MEMS, or other micrometer sized structures.


Find Patent Forward Citations

Loading…