The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Apr. 14, 2011
Applicants:

Sadayuki Yoneshima, Osaka, JP;

Mitsushi Sogabe, Osaka, JP;

Inventors:

Sadayuki Yoneshima, Osaka, JP;

Mitsushi Sogabe, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); B29C 33/30 (2006.01); B29C 51/40 (2006.01); B29C 51/36 (2006.01); B29C 33/10 (2006.01); B29C 33/42 (2006.01); B29C 51/42 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3842 (2013.01); B29C 33/10 (2013.01); B29C 33/306 (2013.01); B29C 33/38 (2013.01); B29C 33/42 (2013.01); B29C 51/36 (2013.01); B29C 51/40 (2013.01); B29C 51/365 (2013.01); B29C 51/428 (2013.01);
Abstract

Provided is a mold part for resin molding and a manufacturing method. A mold part for molding resin includes a base material layer, a design section and uneven sections which abut an inner surface so as to form ventilation sections. The design section has a design surface transferred by a reverse master having an uneven surface. At least the design section out of the base material layer and the design section is formed of a heat resistant material, and the mold part for resin molding is interchangeably attached to the molding tool so that a molding pressure acts in a direction to press the uneven sections against the inner surface of the molding tool at the time of molding the resin molded article.


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