The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Dec. 19, 2012
Applicant:
Preco, Inc., Somerset, WI (US);
Inventors:
Christopher Chow, Lake Elmo, MN (US);
James J. Bucklew, Somerset, WI (US);
Daniel B. Miller, New Richmond, WI (US);
Feng Wu, Lake Zurich, IL (US);
Assignee:
Preco, Inc., Somerset, WI (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/36 (2014.01); B32B 3/30 (2006.01); B32B 3/26 (2006.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/40 (2014.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/085 (2006.01); B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B29C 59/00 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B23K 26/365 (2013.01); B23K 26/0048 (2013.01); B23K 26/0807 (2013.01); B23K 26/367 (2013.01); B23K 26/409 (2013.01); B29C 59/007 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B29C 2035/0838 (2013.01); B29C 2791/009 (2013.01); B32B 2307/412 (2013.01); B32B 2307/516 (2013.01); B32B 2307/518 (2013.01); B32B 2307/54 (2013.01); Y10T 428/24331 (2015.01); Y10T 428/24612 (2015.01);
Abstract
A method of scoring a multi-layer film structure, wherein the multi-layer film structure comprises a metal layer and polymer layer bonded to each other, the method comprises using a single laser beam incident to the polymer layer to produce a score line in the polymer layer, wherein the laser energy is absorbed only by the metal layer.