The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 06, 2011
Applicants:

Takashi Murase, Tokyo, JP;

Kazuko Fujita, Tokyo, JP;

Akio Niikura, Tokyo, JP;

Inventors:

Takashi Murase, Tokyo, JP;

Kazuko Fujita, Tokyo, JP;

Akio Niikura, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/233 (2006.01); B23K 20/16 (2006.01);
U.S. Cl.
CPC ...
B23K 20/16 (2013.01); B23K 20/2336 (2013.01); B23K 2203/10 (2013.01);
Abstract

A method of bonding two members including an aluminum alloy material as one member, and an aluminum alloy material or a pure aluminum material as the other member, the method being characterized in: that the aluminum alloy material for the one member and the aluminum alloy material for the other member are composed of an aluminum alloy containing Mg of not more than 0.5 mass %; and that a bonding process is carried out in a furnace having a non-oxidizing atmosphere at a temperature, at which a ratio of a mass of liquid phases generated in the aluminum alloy material defined as the one member to the total mass of the aluminum alloy material falls within a range from 5% to 35%, on the condition that there is either a coated fluoride-based flux or a coated chloride-based flux between both of the members to be bonded.


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