The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Nov. 18, 2011
Applicants:

Joseph R. Vargas, Garnerville, NY (US);

Steven Seelman, Montclair, NJ (US);

Clarence M. Panchison, Warsaw, IN (US);

Inventors:

Joseph R. Vargas, Garnerville, NY (US);

Steven Seelman, Montclair, NJ (US);

Clarence M. Panchison, Warsaw, IN (US);

Assignee:

Zimmer, Inc., Warsaw, IN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 9/00 (2006.01); B23K 11/18 (2006.01); A61F 2/30 (2006.01); A61F 2/36 (2006.01); B23K 11/16 (2006.01);
U.S. Cl.
CPC ...
B23K 11/18 (2013.01); A61F 2/3094 (2013.01); A61F 2/30907 (2013.01); A61F 2/36 (2013.01); B23K 11/163 (2013.01); A61F 2002/3092 (2013.01); A61F 2002/30451 (2013.01); A61F 2002/30981 (2013.01); A61F 2310/00023 (2013.01); A61F 2310/00407 (2013.01);
Abstract

An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.


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