The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Dec. 30, 2013
Applicant:

AU Optronics Corporation, Hsin-Chu, TW;

Inventors:

Ching-Feng Chen, Hsin-Chu, TW;

Cheng-Min Tsai, Hsin-Chu, TW;

Cheng-Yu Wang, Hsin-Chu, TW;

Assignee:

AU OPTRONICS CORPORATION, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 13/00 (2006.01); H05K 1/14 (2006.01); H05K 3/22 (2006.01); H05K 3/36 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0023 (2013.01); H05K 1/147 (2013.01); H05K 3/22 (2013.01); H05K 3/363 (2013.01); H05K 1/028 (2013.01); H05K 2201/056 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49144 (2015.01);
Abstract

A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.


Find Patent Forward Citations

Loading…