The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Apr. 03, 2013
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Jung Hong Joo, Gyeonggi-do, KR;

Ki Young Jang, Gyeonggi-do, KR;

Woo Yong Jeon, Seoul, KR;

Sang Cheol Shin, Gyeonggi-do, KR;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 23/3107 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/115 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion.


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