The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Dec. 01, 2010
Applicants:

Charles Binninger, Munich, DE;

Ulrich Knauer, Munich, DE;

Helmut Zottl, Munich, DE;

Werner Ruile, Munich, DE;

Tomasz Jewula, Markt Schwaben, DE;

Rudolf Nuessl, Otzing, DE;

Inventors:

Charles Binninger, Munich, DE;

Ulrich Knauer, Munich, DE;

Helmut Zottl, Munich, DE;

Werner Ruile, Munich, DE;

Tomasz Jewula, Markt Schwaben, DE;

Rudolf Nuessl, Otzing, DE;

Assignee:

EPCOS AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H05K 3/38 (2006.01); H01L 23/498 (2006.01); H03H 9/145 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/388 (2013.01); H01L 23/49844 (2013.01); H01L 23/49866 (2013.01); H03H 9/02929 (2013.01); H03H 9/14538 (2013.01); H05K 1/09 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0265 (2013.01); H05K 1/0306 (2013.01); H05K 3/048 (2013.01); H05K 2201/0338 (2013.01);
Abstract

A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.


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