The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Aug. 08, 2014
Merry Electronics (Suzhou) Co., Ltd., Suzhou City, Jiangsu Province, CN;
Ching-Lan Lin, Taichung, TW;
Chen-Mao Yang, Taichung, TW;
Po-Yu Chen, Taichung, TW;
Feng-Min Lai, Taichung, TW;
MERRY ELECTRONICS (SUZHOU) CO., LTD., Suzhou, Jiangsu Province, CN;
Abstract
A composite vibration diaphragm fabrication method includes the steps of: (a) mixing a reinforcing material with a hot melt adhesive to form a first mixture and to let the reinforcing material be wrapped in the hot melt adhesive uniformly, (b) mixing the first mixture with a thermosetting adhesive to form a second mixture, (c) coating the second mixture on a vibration diaphragm material and then heating the second mixture coated vibration diaphragm material, and (d) cooling down the coated vibration diaphragm material in which the second mixture is cured and bonded to the vibration diaphragm material. Thus, when baking the second mixture, the internal hot melt adhesive will be melted and integrated with the thermosetting adhesive, and the thermosetting adhesive will also be cured, enabling the reinforcing material to be uniformly bonded to the vibration diaphragm to reinforce the strength and rigidity of the composite vibration diaphragm.