The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Jul. 09, 2012
Applicants:

Huang-chi Tseng, Hsin-Chu, TW;

Chiuan-ting LI, Hsin-Chu, TW;

Wei-jieh Lee, Hsin-Chu, TW;

Chun-ming Yang, Hsin-Chu, TW;

Kuan-wen Tung, Hsin-Chu, TW;

Inventors:

Huang-Chi Tseng, Hsin-Chu, TW;

Chiuan-Ting Li, Hsin-Chu, TW;

Wei-Jieh Lee, Hsin-Chu, TW;

Chun-Ming Yang, Hsin-Chu, TW;

Kuan-Wen Tung, Hsin-Chu, TW;

Assignee:

AU OPTRONICS CORPORATION, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/042 (2014.01); H01L 31/052 (2014.01); H02S 40/42 (2014.01); F28F 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/052 (2013.01); F28F 3/02 (2013.01); H02S 40/425 (2014.12); Y02E 10/50 (2013.01);
Abstract

A heat dissipation structure is provided and includes a plurality of heat conduction bases and at least one flexible fin. Each of the heat conduction bases includes a first surface and a second surface. A positioning groove is formed in the first surface of each of the heat conduction bases, and the second surface of each of the heat conduction bases is assembled to a backlight surface of a solar module. The fin is coupled to the positioning grooves and connected between the heat conduction bases.


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